Used STRASBAUGH 6DS-SP #9144782 for sale

STRASBAUGH 6DS-SP is a high precision wafer grinding, lapping, and polishing equipment that is designed to provide high performance results in a small footprint. The unit comes with a spindle speed of up to 10,000 RPM, and is able to provide sub-micron accuracies when grinding and lapping silicon, gallium arsenide (GaAs), ceramic, compound semiconductors, and other common wafer substrates. The system utilizes a two-pass grinding and lapping process that ensures the highest levels of accuracy and repeatability. The workpiece is first ground, then lapped to smooth and level the material surface. STRASBAUGH 6 DS-SP also includes a dual-process polishing station, with a fixed spindle speed of up to 600 RPM and a variable speed spindle of up to 1,500 RPM. This unit allows the user to select the exact polishing rate needed to achieve the desired surface finish. In addition to the grinding, lapping, and polishing capabilities, 6DS-SP has an integrated wafer handling machine that ensures that each wafer is properly handled and maintained. This tool seamlessly transfers wafers between processes and detects when a wafer is not square, preventing possible damage due to misalignment. 6 DS-SP also has a self-contained vacuum asset coupled with a dust collection model. This ensures that the environment within the unit is kept clean and free of contaminants. Additionally, the equipment has an integrated cooling system that helps reduce unit temperatures and maintain ideal working conditions. STRASBAUGH 6DS-SP is a highly capable machine that is capable of tackling a wide range of wafer processing tasks. Using its advanced technology, the tool is able to provide consistent and reliable results with a minimum of fuss. The unit's integrated wafer handling, dust collection, and cooling systems make it a great choice for those looking for a robust yet economical solution for their wafer processing needs.