Used STRASBAUGH 6DS-SP #9210309 for sale

STRASBAUGH 6DS-SP is a state-of-the-art 'wafer grinding, lapping & polishing' system for fabrication of advanced semiconductor and optoelectronic device materials. It is designed for use in production applications in a high-performance, cost-effective, and robust manner. STRASBAUGH 6 DS-SP is a reliable tool for achieving superior surface finish, with precision and accuracy, on wafer substrates. 6DS-SP consists of four distinct stages: grinding, lapping, polishing, and secondary grinding. In the grinding stage the substrate is abraded with diamond impregnated grinding discs, or mechanical brushes, to create a planar surface with a three-dimensionally structured profile that includes small rollover irregularities. This process is designed for heavy substrate removal to produce an Initial-Test-Condition (ITC) layer with well-defined micro- and nanostructures. For the lapping stage, 6 DS-SP uses a thick-film lapping process to achieve a pronounced surface relief and removed non-uniform and irregular patterns from the wafer surface. This stage can provide improved substrate flatness and micro-roughness. The polishing stage utilizes diamond paste and/or a delta-electrode process to create a conformally smooth and planarized surface that has accurate and precise control of critical parameters such as total thickness variation (TTV) and root-mean-squared (RMS) roughness. The polishing process can also produce a highly reflective surface finish. For the secondary grinding stage, STRASBAUGH 6DS-SP can be tailored for precision applications requiring ultra-high substrate flatness and uniformity. It also allows for the utilization of additional processes such as high-density-CMP-like growth-planarization. Overall, STRASBAUGH 6 DS-SP is designed to provide superior surface finish and metrology performance at high speeds for wafer substrates. It features multiple grinding, lapping, and polishing options with adjustable parameters for cutting edge material removal and planarizing of the substrate surface. 6DS-SP is ideal for production in semiconductor and optoelectronic device industries.