Used STRASBAUGH 6DS-SP #9211915 for sale
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ID: 9211915
Wafer Size: 8"
Vintage: 1996
CMP Polisher, 8"
Aluminum platens and lifters
Spare parts included
1996 vintage.
STRASBAUGH 6DS-SP is a modern wafer grinding, lapping, and polishing technology equipment. This system is designed to produce high-performance silicon wafers and MEMS components with superior yields and improved device characteristics and robustness. STRASBAUGH 6 DS-SP is comprised of a lapping and polishing platform, a main chassis, and a digital control computer. The lapping and polishing platform is the heart of 6DS-SP unit. This machine consists of four process stations, including a roughing and finishing station, a silver sheet station, a diamond disc station, and a vacuum station. The roughing and finishing station has a lapping platen that can rotate up to 250 RPM. The platen is also equipped with an adjustable tilt mechanism that allows for lapping and polishing in different directions and angles. The silver sheet station is equipped with a ceramic ride-plates for grinding and polishing the surface of the wafer. Finally, the diamond disc station is equipped with a plasticized, coolant-fed, rotational drive head. This station is used for finishing operations and can reach speeds of up to 10,000 RPM. The main chassis of the tool is made from corrosion-resistant stainless steel, and is designed for durability and reliable operation in harsh factory environments. It is equipped with a cooling fan and three low-voltage stepper motors to control the tilt and rotation of the lapping platen, as well as the drive head of the diamond disc station. The digital control computer allows for precise, automated operation of the asset. It is designed to provide enhanced precision and stability for the lapping and polishing processes, and is equipped with an intuitive, menu-driven graphical user interface for easy operation. 6 DS-SP model is highly efficient and yields improved yields and enhanced yields and device characteristics. It is also suitable for use in production of MEMS components with high precision requirements. The equipment is capable of operating at high speeds while producing high-quality results and is ideal for use in the production of silicon wafers for semiconductor fabrication.
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