Used STRASBAUGH 6DS-SP #9314684 for sale

STRASBAUGH 6DS-SP Wafer Grinding, Lapping & Polishing Equipment is a precision polishing machine designed for use in the semiconductor and optoelectronic industries. STRASBAUGH 6 DS-SP system features an automatic, variable-speed drive unit that provides for precise, uniform motion control for both lapping and grinding operations. The machine's tilt, stroke, and orbital motion capabilities allow for both fast stock removal and precise surface finishing of any flat, flexible wafer or challenging substrate materials, including ceramics, glass, and sapphire. It is ideal for semiconductor and optoelectronic substrates up to 150mm in diameter. 6DS-SP tool features an advanced, precision-contoured planar platen with adjustable, programmable center mass and uniform load distribution to ensure the best possible wafer-to-platen contact throughout the entire process. Its precision-controlled rate of infeed facilitates fast stock removal and eliminates chatter for improved surface finish quality. It also offers precise in-process measurement capabilities to control platen pressure, orifice condition, and slurry-particle capture for repeatable results. 6 DS-SP asset offers full-geometry grinding, lapping, and polishing functionality. Its integrated polishing pads feature customizable geometry for polishing wafers with irregular shapes or delicate surface features. The advanced Smart Polish software module delivers automatic sequencing based on pre-defined parameters. Plus, patented Smart Level technology offers quick and easy surface flatness measurements. The model's bright, easy-to-read LED display ensures precise and smooth motion, along with real-time feedback for pressure, speed, and temperature. It also has an easy-to-use, intuitive operator interface and capacitive touchscreen with pre-defined work recipes for accurate and repeatable operation. It includes a wide variety of installation options, for all types of workstations and process designs, and multiple peripheral equipment compatibility to integrate lapping and polishing machines into open process systems. STRASBAUGH 6DS-SP equipment delivers superior wafer edge quality that is ideal for both lapping and polishing tasks in both hard and soft materials. It offers an economical solution for mass production as well as for R&D work, allowing for short lead times and consistent results. Its unique features, such as adjustable mass center and uniform pressure distribution, make it an efficient, cost-effective option for wafer grinding, lapping, and polishing operations.