Used STRASBAUGH 6DS-SP #9314685 for sale

STRASBAUGH 6DS-SP Wafer Grinding, Lapping and Polishing equipment is a state-of-the-art system designed to facilitate the production of high-quality, polished surfaces on semiconductor and other materials. The unit is ideal for grinding, lapping, and polishing operations in semiconductor, MEMS, and optoelectronic wafer fabrication. STRASBAUGH 6 DS-SP machine consists of a 6-axis linear servo motor drive which provides x, y, and z motion capabilities for precise grinding, lapping, and polishing operations. The tool is able to run at high speeds and feature resolutions of up to 0.001 μm for fast and accurate grinding, lapping and polishing. The servo motor drive provides excellent repeatability for tight process control and accuracy. The asset uses a powerful, dual-sided grinding and lapping process. A rotating wafer stage is positioned between two grinding and lapping heads, which can be adjusted independently of each other and driven separately. This dual-sided grinding process results in a precise, mirror-like finish on the wafer surface. The model also features a newly designed platen which is designed to reduce localized temperatures and pressures, preventing deformation of the wafer. The platen is supported by four radial arms which allow for fast and precise lapping adjustments and consistent contact with the wafer. 6DS-SP also includes a powerful polishing subsystem. This consists of three distinct polishing components: a rotating platen, a bonding ring, and a polishing pad. The rotating platen and bonding ring provide a reliable, even surface for the polishing pad to move on. The polishing pad is also adjustable to apply the required amount of force during the polishing process. Overall, 6 DS-SP is an advanced equipment for the grinding, lapping and polishing of wafers and other materials. It is capable of providing high-quality, polished surfaces quickly and accurately, while maintaining tight process control. With its advanced design and features, the system is an ideal choice for semiconductor and optoelectronic wafer processing operations.