Used STRASBAUGH 6DS-SP #9314686 for sale

STRASBAUGH 6DS-SP is a state-of-the-art wafer grinding, lapping, and polishing equipment. It is an industrially-grade precision device developed for use in the semiconductor industry, primarily for the processing of silicon substrates. STRASBAUGH 6 DS-SP utilizes advanced technology to provide high-precision grinding, lapping, polishing, and finishing for substrates such as silicon, germanium, and metal oxides, among others. The system employs a unit of SiC grinding wheels, diamond lapping films, polishing sheets, and finishing films. All of these features are designed to yield superior accuracy and surface characteristics. The grinding wheels are made of silicon carbide, a material that provides superior wear resistance and uniformity. The embedded diamond films provide the necessary abrasive action for lapping and polishing substrates such as silicon and other materials. The polishing sheets are a closed-loop machine that are designed to give an even finish without the addition of abrasives or compounds. The tool is comprised of several distinct parts, including the grinding station, lapping station, polishing station, and finishing station. The grinding station utilizes diamond mounted SiC grinding wheels to grind the wafers with precision and accuracy. The lapping process utilizes diamond lapping films to remove material in a very precise manner. The polishing station uses special polishing sheets to provide an even polishing finish. The finishing station works in a similar manner to the polishing station, but with a focus on accurate and uniform finishing. The asset is completely automated and computer controlled. It is capable of single-wafer processing, making it ideal for a high-volume production environment. The integrated diagnostics and support model ensure that the machine operates at optimal efficiency and yields consistent results. 6DS-SP is essential for companies looking to achieve superior performance and accuracy when grinding, lapping, polishing, and finishing substrates. Its sophisticated and highly automated features make it an ideal choice for the semiconductor industry.