Used STRASBAUGH 6EC #141548 for sale
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ID: 141548
CMP system, 4"
CMP Research, failure analysis, and low-volume production
Semiautomatic operations via color touch-screen GUI
VIPRR Carrier & hydro-lift load station
Single table
22" Diameter polish platen
Integrated pad conditioner
Load/unload station with wafer rinsing
Backside pressure control system
Vacuum / fluids separation unit
6EC Manuals
Option:
(5) Carrier template for small samples:
Configured for 2", or non-standard shapes and sizes
Thickness and shape to be defined.
STRASBAUGH 6EC is a cutting edge wafer grinding, lapping and polishing equipment that provides unparalleled surface finish in wafer production. This system is designed to speed the production of wafers and reduce grinding, lapping and polishing cycles up to 90 percent. STRASBAUGH 6 EC's modular design offers flexibility for customization and configuration for specific wafer sizes, shapes, and thicknesses. 6 E C utilizes a three-phase, stainless steel grinding process. This process consists of a soft grind, medium grind and hard grinding, conditioning, and polishing. The soft grind is the initial step of the process, where the surface of the sample is prepared by grinding away at any bumps or ridges. During the medium grind, high speed circular wafer lapping arms with diamond composite dressing rings minimize surface irregularities. The hard grinding phase is where specific shapes and sizes are imparted to the wafers. The final conditioning and polishing stage gives the samples a glossy and flawless finish. 6 EC utilizes a unique top-down cleaning approach. This approach ensures that the entire unit is cleaned efficiently and effectively while minimizing contamination by preventing the release of particles into the production process. The machine's advanced safety features also protect the operator from potential cross contamination when working with different material contaminants. STRASBAUGH 6 E C is controlled by an intuitive touchscreen control panel complete with a process history, and data storage that are both user programmable. This control panel also allows for setting trough speed, dwell times between steps, pressure range, grit sizes and depths, and coolant concentrations. Other features include an easy to use programmable command language and customizable recipes for repetitive processes. In conclusion, 6EC is a wafer grinding, lapping and polishing tool that is designed to reduce wafer production time while producing a high quality surface finish. This asset is driven by an advanced and intuitive touch control panel that provides process history, data storage and customizable recipes. The unique top down cleaning approach prevents cross contamination while cleaning efficiently and effectively.
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