Used STRASBAUGH 6EC #293648418 for sale
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ID: 293648418
Wafer Size: 8"
Vintage: 2000
CMP Wafer polisher, 8"
VIPRR Polishing head
Load station
2000 vintage.
STRASBAUGH 6EC Wafer Grinding, Lapping and Polishing Equipment is an ideal solution for backside thinning, preparation, and polishing of most semiconductor materials, as well as MEMS and compound solar products. With its robust features and capabilities, STRASBAUGH 6 EC is an optimal high performance system for a variety of materials and substrates. 6 E C unit is fully automated and equipped with a waferhandling robot, allowing unattended operation. It is the ultimate in wafer polishing flexibility, providing continuous lapping and chemical mechanical polishing (CMP) for many different configurations of wafer processing. It is designed to minimize part-to-part repeatability issues and improve part processing accuracy. For maximum performance, STRASBAUGH 6 E C slicer is CNC controlled and equipped with a unique slicing mechanism. With its unique stock removal capability, 6EC is capable of reducing wafer-level thinning times by up to 50%. 6 EC's innovative way of slicing and grinding wafers preserves surface topography and thinning times are greatly reduced. STRASBAUGH 6EC also features a fully automated slurry delivery machine for maximized CMP performance. STRASBAUGH 6 EC contains a highly energy efficient, low-maintenance wafer grinding, lapping and polishing tool that produces higher quality parts with fewer defects. It is capable of generating a bright, homogeneous polish and low-defect finish that exceeds specification requirements. 6 E C's slicing, grinding, lapping and polishing processes can all be controlled from a single workstation, providing complete control of process parameters. Additionally, STRASBAUGH 6 E C's CNC control frees up personnel for more value-added tasks. 6EC is designed for maximum operator safety and ergonomics with a safety-shielded housing, temperature control and dust extraction asset. It also features built-in cooling and noise reduction systems. 6 EC's unique features optimize stock removal and ensures tight process repeatability and clean operation with nominal dust production and little risk of cross-contamination. STRASBAUGH 6EC Wafer Grinding, Lapping, and Polishing Model is a complete and versatile solution for thin sectioning, preparation and finishing of semiconductors, MEMS, and compound solar products. Its features and capabilities provide the most efficient production of confidently high-quality, repeatable parts with minimal downtime.
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