Used STRASBAUGH 6EC #293709497 for sale
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ID: 293709497
Wafer Size: 4"-8"
Vintage: 2000
CMP System, 4"-8"
(2) Slurry dispenses
VIPRR Carriers
Hydrolift load station
Pad conditioner
2000 vintage.
STRASBAUGH 6EC is an automated wafer grinding, lapping and polishing equipment that provides superb accuracy and repeatability. It is designed with a large automated 15-inch Chuck, with an optional 26-inch Chuck also available, for cast-to-size samples in both plastic and metal materials. The rotating diamond grinding wheels are designed with a unique clearance angle ratio and a self-centring support system to ensure consistent flatness and parallelism across the wafer. This, combined with an automated stage, provides unparalleled motion control for both coarse grinding and fine polishing. The unit uses a coarse grinding wheel to rapidly and accurately address the flatness and parallelism requirements of the surface. After this step is complete, the lapping process is then used to further refine the flatness and parallelism accuracy of the surface. This is done with diamond particles suspended in a liquid, which is then fed across the wafer by the automated stage. Once the lapping process is complete, the polishing action is then used to ensure that the surface finish of the wafer is ideal for use in photovoltaic cells or other optoelectronic devices. This is done by using a polishing pad, which is capable of being adjusted in frequency and amplitude, allowing for very precise polishing. The grind/lapping/polishing process is completed in a controlled manufacturing environment with tight environmental control systems. Due to its excellent repeatability and reliability, STRASBAUGH 6 EC is a highly reliable machine for flatness/parallelism and surface finish requirements for both standard and custom wafers. In addition, its large 15-inch Chuck can accommodate larger substrates with ease, while the robust automated stage provides superb motion control to ensure consistent results with each wafer process. Furthermore, the automated lapping/polishing stages allow for flexible configuration in order to address differing flats and surface finish requirements without the need for manual adjustment.
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