Used STRASBAUGH 6EC #293809254 for sale

STRASBAUGH 6EC is an advanced wafer grinding, lapping and polishing equipment designed to provide throughput and repeatability in production and research environments. This versatile machine is capable of handling a wide range of wafers, including Silicon, GaAs, GaN and Silicon Carbide with both round and rectangular wafer configurations. STRASBAUGH 6 EC is comprised of three modular pods that offer maximum flexibility for application requirements. In the grind pod, rapid stock removal is achieved through the operation of 8 stations, each containing two diamond wheels that rotate and oscillate to remove material from the wafer's surface. Powerful motors along with custom designed wheels enable high efficiency and accuracy during grinding. The lapping pod features a precision slurry delivery system that distributes opaque or transparent lapping fluid onto the wafer's underside. After the wafer has been exposed to the slurry, the pod's lab technicians then use a final lapping process to provide a homogenous surface. In the polishing pod, 8 stations are available that supply a combination of abrading and cerium oxide slurries to the wafers to produce superior finishes and superior material removal. The active slurry management and load cell unit ensures rapid and repeatable polishing, even with aggressive slurries. The fully integrated robotic arm between the pods simplifies operation, allowing for easy loading and unloading of wafers. The entire 6 E C structure, which includes all pods, motors, safety components and other components, is enclosed in a sound dampening cabinet, allowing for easy integration into existing production lines. The cabinet also includes a solid state air filtration machine to help capture and dispose of debris produced during wafer grinding, lapping and polishing. For increased safety and convenience, an operator interface is also included for controlling 6 EC's operations. This interface allows technicians to control the process parameters, testing protocols, and other operational parameters with ease and accuracy. In addition, the tool is designed to provide high production yields with excellent operational repeatability. This extremely versatile machine efficiently handles a wide variety of wafer sizes, materials and configurations, while providing high production throughput and maximum repeatability.. It is perfect for both low and medium volume production runs in both research and development environments.