Used STRASBAUGH 6EC #293816891 for sale

STRASBAUGH 6EC is an automated fully programmable wafer grinding, lapping and polishing equipment. This highly precise surface and lapping system is engineered to finish surfaces on wafers. It consists of four main controllers: the surface finish controller, the orientation/locking controller, the grinding/lapping controller, and the polishing controller. The surface finish controller is the core of the unit, allowing the operator to quickly recover from any mechanical grinding, lapping and polishing issues, as well as controlling all the sample rotation and set points for the surface finish. It is capable of 3D surface profiling and can profile up to three surfaces at once. It also has a step scan machine which sequentially steps around to inspect the surface of each wafer, maximizing the throughput of the tool. The orientation/locking controller holds the wafer being processed securely and precisely in place, making sure the same amount of pressure is applied no matter the location or size of the wafer. It also provides quick and accurate switching of the lock mechanism between sample position. The grinding/lapping controller provides the operator with the ability to move the wafer around the grinding/lapping platen with independent controlled linear and rotational motion, as well as allowing for cycles to be performed with a constant level of force. This control incorporates an in-sequence stop motion. The polishing controller is used to apply the final polishing to the surface of the wafer. It is capable of recording the final polishing weights for each sample, taking into account the density of the material being polished as well as its dimensions. This control is designed to give the operator the ability to control the polishing pressure in a range from low to high. STRASBAUGH 6 EC is a highly precise asset that is designed to distribute equally the pressure applied to wafers during surface grinding, lapping and polishing. With its four controllers, in-sequence stop motion, 3D surface profiling, and the ability to control polishing pressure, 6 E C offers an unmatched level of accuracy for the processing of wafer surfaces.