Used STRASBAUGH 6EC #9105741 for sale

STRASBAUGH 6EC is an automated wafer grinding, lapping, and polishing equipment for the production of ultrathin planarization surfaces. The system includes a two-stage low frequency grinding motor with adjustable torque for fast and precise planarization. An exteriometric control unit ensures uniform planarization across each side by maintaining a constant infeed speed. The machine is designed with integrated abrasives housed in a cassette for quick and easy changeovers. STRASBAUGH 6 EC utilizes a 6-pocket diamond/carbide grinding wheel with variable speed motors. The wheel has a grit size of 0.3 to 0.7 microns for precision grinding. An adjustable feeder wheel allows for high speed, low force grinding. The wafers are secured on a rotary platen with a vacuum chuck to ensure even contact and accurate grinding. 6 E C also includes a lapping and polishing station. The lapping plate features a high-speed motor and adjustable frequency drive to accomplish even lapping of the wafer surfaces. It is designed with an algorithmic program that takes into account the contact area of the wafer and the rotational speed to ensure an even finish. A patented oscillation mechanism ensures optimal polishing of the wafer surface. The tool also features a slurry and clean station for sloppy wafer processing. The design allows for simple nozzle changes for efficient cleaning of the surface. The asset is also designed to collect spent slurry and filter out impurities. 6 EC is designed with a user-friendly HMI (Human Machine Interface). The graphic display, along with an operator dialogue, facilitate the process operation. It features a push-button control panel, which allows for easy parameter adjustments and process monitoring. The model runs on a Siemens S7-300 controller that computes process variables and real-time data. The equipment is designed with advanced safety monitoring and preventive maintenance capabilities to improve its performance and efficiency. STRASBAUGH 6 E C is an all-in-one automated wafer grinding, lapping, and polishing system that simplifies wafer production. It is highly reliable and provides precise planarization for ultrathin wafers. Its advanced safety features and user-friendly HMI make it an ideal choice for the ultra-precision planarization of thin substrate surface.