Used STRASBAUGH 6EC #9227505 for sale

ID: 9227505
CMP System Heads included.
STRASBAUGH 6EC is a wafer grinding, lapping, and polishing machine that combines modern technology with efficient processing for a reliable solution to wafer grinding, lapping, and polishing needs. It is designed with an automated control equipment that enables precise and consistent results as well as enhanced user safety. The system utilizes an integrated, programmable controller, PC-based software, and stepper motor-driven wafer grinding and polishing stages. STRASBAUGH 6 EC is equipped with a range of wafer grinding stages and one lapping stage. The grinding stages are designed to safely grind down thin films and other surface features on wafers with accuracy down to 0.1 micron. The lapping stage expands the capabilities of the unit by using abrasive media to fabricate up to 200 micron flat surfaces on the wafer. 6 E C is also equipped with adjustable, pressure-controlled polishing heads with low speed, high-torque motors. The polishing heads are programmable and fully automated to ensure consistent results and accuracy. The friction and pressure of the polishing unit can be adjusted to maximize performance and prevent surface damage. The machine's process monitoring feature allows users to control and review various parameters, including four-axis positional accuracy and material thickness. The positional accuracy provides a way to measure and adjust the wafer alignment during grinding and lapping. The full tool is designed for flexibility, allowing users to customize their processes and workflows according to their specific requirements. Safety is an important feature of the asset and 6 EC integrates a range of features that secure the safety of the operator. These include an emergency stop button, pressure overload protection, and air systems to protect the operator's eyes from any airborne debris generated by the model. Overall, 6EC is a reliable and precise wafer grinding, lapping, and polishing equipment that is designed for consistent and efficient wafer processing. It is highly customizable and user-friendly, with a range of safety features in place to protect operators in every stage of their wafer processing.
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