Used STRASBAUGH 6EC #9294179 for sale

STRASBAUGH 6EC is a leading edge, wafer grinding, lapping & polishing equipment. It is designed to yield superior flatness and surface finish of silicon wafers while keeping them free of contamination, scratches and other defects. STRASBAUGH 6 EC system is extremely accurate and efficient, as it can achieve surface finish better than 0.2 nm Ra and extremely tight 3 sigma flatness of 3um in 12 flat orientation. 6 E C consists of four main stations, a rough grinding, a wafer lapping & de-burring, an ultra-fine lapping & polishing, and a cleaning/dry station. The rough grinding station is used to reduce the thickness of the wafer to the desired size and level off the surface of wafers efficiently with minimal surface damage. The wafer lapping & de-burring station features a magnetic Float Plate for quickly removing the slurry and debris, allowing for a rapid exchange of pads, improving efficiency and avoiding contamination. The ultra-fine lapping & polishing station is designed to achieve an extremely high-precision surface finish of less than 0.2nm RA. It can be configured with either a Tape Transfer Arm (TTA) or a Pad Transfer Arm (PTA). Finally, the cleaning and drying station features an integrated heated drying unit for quickly and thoroughly drying the wafers, with a total of eight nozzles providing leading-edge cleaning performance. 6EC machine also features a number of automated processes that streamline the grinding, lapping & polishing process and optimize efficiency. Specifically, it features an automated wafer positioning & handling tool, automatic size adjustment mechanisms, wafer clamping and unclamping, pad and wafer transfer, as well as a variety of visualization & safety systems. The overall asset is also designed for robust, reliable and easy maintenance experience. In conclusion, STRASBAUGH 6 E C is a modern, high-performance wafer grinding, lapping & polishing model that is designed to deliver superior flatness and surface finish results for silicon wafers. With its powerful grinding, lapping & polishing functions, as well as automated processes and easy maintenance, 6 EC makes it possible to grind, lap, and polish virtually any type of wafer with unparalleled precision and speed.