Used STRASBAUGH 6EC #9296334 for sale

STRASBAUGH 6EC provides a robust and reliable solution for wafer grinding, lapping and polishing. It is the industry-leading tool for producing 6-inch silicon wafers with constant flatness measurements and straight, clean edges. STRASBAUGH 6 EC smoothes, cleans, and imparts a uniform finish to the material undergoing the process by grinding, lapping and polishing. 6 E C is designed to provide the precision and reliability that the modern semiconductor industry needs. It is a very versatile machine, capable of the grinding, lapping, and polishing of various materials such as silicon, quartz, glass, ceramics, and optical substrates in wafer sizes from 5" up to 8" in diameter. 6 EC is built in two versions — single-spindle and three-spindle — so it can be configured to suit different production needs. The three-spindle version makes it possible to perform a combination of grinding, lapping, and polishing operations in a single pass. STRASBAUGH 6 E C is the world's first true 6-inch wafer grinding and polishing equipment. It has a robust and stable design structure, with heavy duty linear bearings, oversized ball screws, and custom-designed grinding and polishing heads for higher precision. It also includes an advanced control system and automated features for fast and consistent processing. The machine features several process modes, namely grinding, lapping, and polishing. Each of these modes offer precise control of various parameters such as grinding/polishing pressure, abrasive concentration, cycle rate, and cut angle. This ensures that the wafers are consistently repeatable across the entire production run. 6EC is designed to accommodate a wide variety of accessories for customizing each process to meet any application needs. These include diamond grinding wheels, diamond slurries, polishing rings, and buffers. Accessories further include a dust collector unit, a lubrication machine, and pressure gauge to measure the grinding pressure inside the grinding wheel. STRASBAUGH 6EC is capable of producing high-quality wafers in shorter cycle times, and it is extremely accurate and stable during grinding and polishing processes. It allows fast reconfiguration and setup for faster changeovers and excellent throughput levels. Its integrated control tool provides a 100% monitoring of all processes to ensure the desired results are precisely achieved.