Used STRASBAUGH 6EC #9398709 for sale

STRASBAUGH 6EC is a high-performance wafer grinding, lapping and polishing equipment that is designed for use in applications requiring precise surface finish and low surface defectivity. The system utilizes a precise and robust two-stage lapping platform to grind, lap and polish wafers to an exceptionally high level of surface quality. STRASBAUGH 6 EC is equipped with two platen stages, each having a 12" diameter traversing chuck and a low-inertia thermal plate. The first stage of the unit is designed to grind the wafer surface to create a mirror-like finish with high surface uniformity prior to lapping and polishing. This is done with a high-precision feed control, variably adjustable to the surface flatness requirements of each wafer. The grinding plate is cooled by an external running water supply and is equipped with ZoneGuard debris control machine to keep debris from exiting the workzone. The second stage of 6 E C is a high-accuracy lapping stageequipped with quick-change lapping/polishing media such as diamond powder or alumina slurries for maximum finish control. The platen is heated or cooled for optimal finish and surface defect creation. Once again, precision feed control is utilized to ensure precise surface uniformity. The platen is equipped with a high efficiency ventilation tool which removes the used media particles from the workzone to maintain a clean work environment. The asset is operated in a fully automated manner using a user-friendly PC interface. The user is able to store and recall process parameters, view real-time wafer video and wafer metrology results, and monitor status of the model. State-of-the-art robotics are used to manipulate the wafers in the equipment, ensuring optimum results with minimal manual operations. This allows for a fast, efficient and reliable process with minimized operator intervention. 6 EC is a powerful and reliable wafer grinding, lapping and polishing system that offers excellent surface finish uniformity and high defectivity levels, with the added benefit of a highly automated process thus improving productivity and reducing manual handling of wafers.