Used STRASBAUGH 6EC #9399211 for sale

STRASBAUGH 6EC Wafer Grinding, Lapping & Polishing equipment is designed to deliver superior performance in automated processing of different sizes and types of materials. It is a multi-axis single-spindle, dual-load system, with six-axis integrated grinding, lapping and polishing capabilities for wafers. STRASBAUGH 6 EC comes with various special features which offer it a unique combination of automation and flexibility. These include a custom slave-axis interface, a state-of-the-art open architecture design, precision linear encoders, a high-speed shuttle, external robotic interface and a dynamic downward pressure control. 6 E C can be used to process wafers up to 8" in diameter and can handle various materials including quartz, silicon, sapphire, sapphire-on-quartz, and glass substrates. 6EC features advanced spindle technology, enabling high precision grinding, lapping and polishing with minimal weight on the wafer. This significantly reduces the risk of damage to the wafer. The unit also offers a variable speed drive and low vibration construct which helps maintain superior performance and improved accuracy. 6 EC is highly efficient and versatile, which enables it to be used for a variety of applications. It can be used for high volume production or used for prototyping. It is easy to operate, with advanced touch screen controller software included. This allows for data input, allowing users to recall processing recipes, optimize production outputs, retain settings and easily set up grind, lap and polish profiles. STRASBAUGH 6 E C also offers a number of safety features to ensure the safety of operators and processes in mind. These include a safety interlock machine, ground fault interrupter and electrical cabinet. Overall, STRASBAUGH 6EC Wafer Grinding, Lapping & Polishing tool is a powerful, reliable and efficient tool which offers superior performance and automation capabilities in a range of wafer processing applications.