Used STRASBAUGH 6EE #293665130 for sale

STRASBAUGH 6EE Wafer Grinding, Lapping & Polishing Equipment is an advanced wafer fabrication processing platform designed to provide a complete end-to-end solution for the production of semiconductor and MEMS devices. With its integrated design and modular architecture, the system can be easily scaled and tailored to meet specific wafer-level fabrication requirements. The unit is powered by STRASBAUGH patented MAPL (Multiple Axis Polishing) technology which enables users to precisely control the orientation and surface profile of the wafer to create high-quality surfaces. It combines the advantages of conventional wafer grinding and polishing processes with the higher precision and quality associated with Abrasive Jet Machining (AJM) and CMP processing. The MAPL technology also allows for improved process uniformity and reduced yield-loss related to wafer cracking. The machine can automatically adjust from a range of speeds and pressure settings, allowing it to accommodate a variety of wafer geometries and surface specifications. The tool also features a high-efficiency vacuum asset and an automated belt-loading model for non-stop operation. 6EE's onboard diagnostic equipment can monitor and provide feedback on the current state of the wafers being processed, allowing for greater control over the entire fabrication process. In addition to the MAPL technology, STRASBAUGH 6EE also includes a variety of tools and accessories that enhance the system's overall capabilities. This includes an in-process wafer analysis unit that can monitor the wafer's orientation and monitor the progress of the process as it progresses in real-time. Other features of the machine include a removable belt and wafer tray to facilitate changing workloads in a short period of time. The tool also includes a variety of other modules and options such as lapping plates, polishing pads and application-specific tools. 6EE is the ideal platform for a variety of wafer processing applications, including single-sided and double-sided polishing and grinding, as well as back-grinding for semiconductor wafer processing. The asset is designed to reduce costs and increase efficiency while maintaining a high degree of precision of fabrication results. Its advanced MAPL technology and optimized processing parameters ensure consistently high-quality wafers, enabling it to meet the requirements of the most demanding semiconductor fabrication applications.