Used STRASBAUGH 6EG #293773402 for sale

STRASBAUGH 6EG equipment is a wafer grinding, lapping and polishing system used for semiconductor workpiece processing and CMP (chemical mechanical planarization) applications. It is a fully automated unit equipped with sophisticated software and easy-to-use graphical interface. The machine is powered with a three-axis linear drive tool that provides ultra-high precision wafer grinding, lapping and polishing. This drive asset allows the user to accurately and quickly adjust the grinding, lapping and polishing speeds across multiple stages, creating a uniform finish regardless of the surface topography of the workpiece. The model has a 6-inch wafer holder to accommodate a wide range of workpiece sizes, allowing for simultaneous multiple wafer processing. The equipment has a highly flexible process chamber allowing for a wide range of process requirements, including from standard etching to the more intensive CMP processing. The system also utilizes a unique gas/vacuum separation unit for efficient material handling, used to protect the grinding and polishing element from damage. The machine also guarantees a very precise finish and superior edge quality by using an advanced polishing film delivery tool. The design also has integrated air-bearing rollers and a two-in-one anvil grinding asset that allows for grinding and polishing in one step. In addition, the model uses an automated calibration equipment which automatically adjusts the grinding, lapping and polishing speeds, eliminating operator error. The system also includes several monitoring features. It offers an image analysis unit which allows the user to monitor the process and detect any anomalies or changes in the surface topographies. This machine provides feedback to the user allowing any necessary adjustments to be made, instantly. In addition, the tool is also equipped with a network connection which allows monitoring from remote locations or integration with company wide systems. Overall, 6EG asset is a well designed and highly reliable wafer grinding, lapping and polishing model providing superior quality finishes for semiconductor workpiece processing and CMP with fast and accurate results.