Used STRASBAUGH 6EG #9314238 for sale

STRASBAUGH 6EG
ID: 9314238
CMP System.
STRASBAUGH 6EG is an advanced wafer grinding, lapping, and polishing equipment designed to achieve superior polishing results on a wide range of semiconductor materials. This system excels in producing polished substrates with the highest quality specifications. This industrial unit combines a versatile wafer grinder, lapper, and polisher into a single platform capable of producing a wide range of applications. 6EG provides a customizable and automated platform for wafer grinding, lapping, and polishing. It boasts a unique dual port design, allowing the user to optimize for different substrates and applications. The platform includes diamond wet and dry grinding, lapping, and polishing with gamma radiation damaged substrates. STRASBAUGH 6EG features an integrated wafer grinding, lapping, and polishing station that employs a self-contained fluid management machine. This tool allows for a variety of processing techniques to be used, including electrochemical grinding, passive abrasion, chemical mechanical polishing, and even the combination of all these in various recipes. It offers uniform and consistent operation for each step of wafer grinding, lapping, and polishing. Furthermore, 6EG employs advanced motion control, an integrated vision asset for automated wafer recognition, and a multi-stage air purifier to ensure clean air circulation. Additionally, the model includes a 3-axis dead-loaded pad polisher, an evolutionary diamond slurry delivery and recovery equipment, and a multi-position macro robotic end effector. All these components are designed to ensure high precision results. STRASBAUGH 6EG is capable of processing large substrates as well as small substrates, offering flexibility for both research and industrial purposes. It is designed for ease of setup and operation, allowing the user to perform complex processes and achieve excellent yields. Additionally, the system is equipped with safety-rated components to provide a safe and reliable environment during use. Overall, 6EG wafer grinding, lapping, and polishing unit offers an industry-leading solution for advanced semiconductor substrates. By combining powerful grinding, lapping, and polishing capabilities with a robust control and management machine, this platform offers reliable and quality results that can meet the stringent demands of research and industrial applications.
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