Used STRASBAUGH 6SR-4 #173189 for sale

STRASBAUGH 6SR-4 Wafer Grinding, Lapping & Polishing Equipment is a fully automated, high-performance machine designed to produce precision wafers with low roughness values. 6SR-4 is state-of-the-art system, intended for high-volume production, with consistent results. The unit incorporates a 6-axis, motion control machine for precise motion control and easy setup. This motion control tool is designed for optimal grinding and polishing cycles, with the ability to program grinding and polishing profiles independently. Additionally, the asset is equipped with an Automated Wafer Loader, allowing for automated loading of wafers and elimiating the need for manual wafer handling. STRASBAUGH 6SR-4 can process wafers up to 6 inches in diameter and is equipped with a spindles ranging in speed up to 5000 rpm, allowing for fast and efficient grinding and polishing operations. The small footprint of the model also make it ideal for low-space production environments. The grinding, lapping and polishing is enabled by a range of processes, specifically designed for wafer handling and include functions such as chip binging, optical thinning, backside grinding, single-plate lapping, double-plate lapping, laser surface texturing and juliet surface conditioning. The equipment is made of quality material, designed for durable, long-term performance and easy maintenance. All of the components of 6SR-4 are designed for high level of precision, to yield high-performance wafers that are suitable for use in a range of applications. STRASBAUGH 6SR-4 is highly automated and comes equipped with user-friendly software to allow setup and operation of the system to be quick and simple. This software includes machine parameter data management functions, allowing users to accurately record and track their production process and parameters used. Overall, 6SR-4 is a fully automated, high-performance machine designed to produce precision wafers. The unit is optimized for high-volume production, with its motion control machine and range of processes designed for wafer handling and fast grinding, lapping and polishing operations. It is one of the most advanced systems available for the manufacture of high-quality wafers.