Used STRASBAUGH 6T #9045659 for sale

STRASBAUGH 6T is a leading wafer grinding, lapping, and polishing equipment. It is a table-top machine ideal for laboratories, universities, and research institutes that require higher substrate throughput. The machine has an 8" dia. wafer capacity and two lapping and polishing platters with a 5 micron finish. The unit is precision-controlled, providing excellent flatness and high-taper results. 6T integrates a rigid base to minimize vibration and optimize the substrate and lapping plates conformance with low breakage. The machine can be manually operated or programmed with the user-friendly software. It also incorporates two independently adjustable air or nitride bearing-supported spindles that move the platters in and out of the lapping area and adjust speed allowing for low-surface finish, better planarity, and the elimination of defects. The main features that makes this an ideal wafer grinding, lapping, and polishing system include its simple operation and intuitive user-friendly software interface. With the auto-calibration feature the user can greatly reduce setup time. The unit also offers variable speed control that can be adjusted according to the polishing requirements. STRASBAUGH 6T is equipped with a 9 Kw high-efficiency, high-frequency motor with optional forced-air cooling that helps the user achieve superior flatness and planarity across the polishing surface. It also incorporates a high-stability stroking mechanism that ensures consistently accurate results. The on-board sensors automatically detect polishing consistency and job status. 6T's advanced design also includes a loading/unloading robot to streamline the lapping and polishing processes and prevent human error. The robot is fully automated, transporting the wafer from the workstation to the lapping/polishing area, automatically adjusting lapping force, and loading the polishing media. Overall, STRASBAUGH 6T is a reliable and efficient wafer grinding, lapping, and polishing machine designed to deliver consistently accurate results. It provides a versatile platform for wafer grinding, lapping, and polishing processes, and is equipped with powerful components and advanced features to ensure superior flatness and planarity across the polishing surface.