Used STRASBAUGH 6UR-1 #9070478 for sale

STRASBAUGH 6UR-1 Wafer Grinding, Lapping & Polishing equipment is a state-of-the-art equipment offering specialized processing of virtually any type of substrate with the highest quality, repeatable results. 6UR-1 system is a fully automated platform, capable of grinding, lapping and polishing wafers of various sizes. The unit has four processing chambers, each fitted with its own set of dedicated precision grinding, lapping and polishing tooling to maintain the highest level of repeatability regardless of process. STRASBAUGH 6UR-1 is designed to accurately process all types of substrates including monolithic substrates; or up to 300mm wafers, handling up to 1 inch thick wafers. 6UR-1 is capable of performing a wide range of applications including CMP, CMP Chemical-Mechanical Polishing, Nanotechnology for semiconductor applications, MEMs (MicroElectroMechanical Systems) and advanced processing for wireless and telecom components. All STRASBAUGH 6UR-1 automation features are designed to reduce setup costs, improve production efficiency, and eliminate process trepidation. 6UR-1 machine is equipped with a load/unload station and a fully programmable robotic arm, to provide precision loading and unloading of wafers. The robot can be used to transfer wafers from the load station to any of the four processing chambers where both the grinding wheel and the lapping plate can be changed to perform different types of processes. The tool is also equipped with sensors that enable the automated process control, providing the highest precision and repeatability for each process. STRASBAUGH 6UR-1 asset also features automated data acquisition capabilities that provide real-time process tracking and analysis. This allows for precise quality control and process monitoring, using a range of parameters such as pressure, water flow/temperature, wheel/plate RPM, etc. This can help reduce process variation and minimize scrap. In conclusion, 6UR-1 Wafer Grinding, Lapping & Polishing model is a reliable and complete equipment for processing numerous types of substrates. The automated data acquisition and robotic arm offer accurate and repeatable results, while allowing process monitoring and quality control with real-time feedback. The system is equipped with four processing chambers, each dedicated to a specific process, and can handle up to 300mm wafers, making it an optimal solution for a wide range of applications.