Used STRASBAUGH 6UR-4 #9180059 for sale

ID: 9180059
Polisher (4) Spindles 12" Pan polisher AC Drives 230/60/3.
STRASBAUGH 6UR-4Wafer Grinding, Lapping & Polishing Equipment is a highly automated system that is designed to provide accurate and efficient grinding, lapping, and polishing of semiconductor wafers. With the integrated drive unit, STRASBAUGH 6UR-4 features a unique mechanical means of controlling the position of the grinding tool, allowing for high precision and accuracy. This allows the grinding wheel to move over the wafer to create intricate micro-structures, and the lapping tool to smooth out and flatten the surface. STRASBAUGH 6UR4 also has an integrated polishing wheel that allows for a final polish of the surface. 6 UR 4 is capable of setting a range of process conditions for each step involved in the overall process, including the number of abrasive steps, speed, aperture size, and time. This allows the operator to constantly adjust the parameters according to the specific requirements of each wafer. Additionally, the machine includes programmable process control, which allows for more detailed optimization of the process, and is capable of running both in-line and off-line processes. STRASBAUGH 6 UR 4 is manufactured using stainless steel and other hard materials, making it highly durable and resistant to corrosion. The tool has a modular design, which allows for easy disassembly and assembly of the asset components. Additionally, it features easy access covers that allow operators to quickly adjust the process parameters. Overall, 6UR4 is a highly automated, robust, and precise wafer grinding, lapping, and polishing model. It is capable of running a range of processes for semiconductor wafers, and is easy to use and maintain. Its adjustable process parameters provide precise adjustments, and its modular design makes it convenient to take apart and assemble quickly. Thanks to its versatility, durability, and accuracy, it is an ideal choice for any application that involves precision micro-structuring of wafers.
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