Used STRASBAUGH 6Y-15 #293622256 for sale

STRASBAUGH 6Y-15 is a versatile all-in-one wafer grinding, lapping, and polishing equipment designed to provide a single, optimized solution for manufacturing operations. This system is capable of handling a wide variety of tasks such as centerless grinding, outer and inner diameter grinding, and surface finishing, as well as grinding and perfuming of hard and soft materials. 6Y-15 unit is suitable for grinding, lapping, and polishing crystalline silicon and other materials. Its versatility allows it to be used with a wide range of mounting systems, tooling, and features, making it the ideal choice for a variety of usage scenarios. The machine is outfitted with a 4-axis XYZC robotic manipulator with a 10x microscope, which is used to control the grinding and polishing processes. STRASBAUGH 6Y-15 tool is the industry standard for wafer grinding and polishing. The asset includes two high-speed mass finishing heads that provide full control over motion and particle size selection, allowing for accurate process parameters. The grinding/lapping head is available in both straight and angular configurations, while the polishing head can be configured in both planetary and rotary modes. Additionally, 6Y-15 model is equipped with a dust collection equipment and an automatic slurry replenishment system. The latter helps ensure that the optimal amount of lubricants and coolants are added during the polishing process. This unit utilizes a special slurry pump and an online monitoring machine to keep track of the lubricant level. STRASBAUGH 6Y-15 tool also features a range of safety features to protect both the operator and the asset from potential harm. These include an emergency shut-off switch and a ground fault circuit interrupter, as well as a proximity sensor that alerts the operator to when the wafer is close to the table. Also, the model includes an integrated air cleaning and dust collection equipment to ensure a pollution-free working environment. Overall, 6Y-15 system is an all-in-one wafer grinding, lapping, and polishing unit that offers unparalleled versatility and accuracy. Featuring a robust set of safety features, this machine is suitable for a wide range of operations in a variety of industries. And, thanks to its automatic slurry replenishment and dust collection tool, this asset is able to keep grinding and polishing operations free of pollutants and waste.