Used STRASBAUGH 6ZR-2 #293633977 for sale

The Strassbaugh STRASBAUGH 6ZR-2 is a state-of-the-art wafer grinding, lapping & polishing equipment, designed to provide superior throughput and production yields. The system features advanced, automated grinding and polishing technology, enabling efficient and reliable wafer manufacturing operations. 6ZR-2 is composed of a base unit and two individual heads that are mounted on the base. The base unit includes two grind heads, two lapping heads, polishing spindles and chucks, and an adjustable grinding/polishing head. The two individual heads each feature an independent rotational axis and an integrated air/vacuum source, optimized for grinding, lapping, and polishing performance. The air/vacuum source is designed to enable precise grinding and lapping operations, with desired particle size. In particular, STRASBAUGH 6ZR-2 is equipped with a pneumo-mechanical load/unload method to allow operators to automatically adjust the load and adjust the rotational cutting speed. This allows for quick and consistent throughput for wafer production. The polishing spindles of 6ZR-2 are available in various sizes to fit various wafer sizes, providing enhanced precision and increased accuracy. The spindles are also equipped with remote adjustment and monitoring capabilities, enabling operators to view and adjust cutting speed and other parameters from an operator console. STRASBAUGH 6ZR-2 is also compatible with a variety of wafer polishing compounds and accessories, such as diamonds, abrasives, and polishing pads, allowing for an infinite range of grinding, lapping, and polishing techniques. Additionally, the unit is further equipped with a variety of advanced, automated wafer and surface defect inspection techniques, ensuring manufacturing accuracy and quality. Overall, Strassbaugh 6ZR-2 is an advanced, feature-rich wafer grinding and polishing machine, designed to increase throughput, reduce production costs and improve quality in the wafer manufacturing industry. Equipped with sophisticated automation and precise wafer inspection techniques, the tool has the capability to produce consistent, precise results while reducing grinding, lapping and polishing time.