Used STRASBAUGH 6ZR-2 #9221840 for sale

STRASBAUGH 6ZR-2 is a high-performance wafer grinding, lapping and polishing equipment designed for use in precision semiconductor processing. The system features a 6-axis robotized platform for precise handling of up to four wafers simultaneously. It is capable of processing all wafer materials including silicon, germanium, sapphire, and quartz. 6ZR-2 offers lapping and polishing to a variety of low roughness surface finishes and utilizes several proprietary technologies to ensure high process quality. The unit includes a state-of-the-art robot arm made of solid industrial aluminum alloy that includes a built-in mechanism for loading and unloading of wafers. The robot arm is driven by a high speed stepper motor that is capable of providing extremely accurate and repeatable motions allowing for fast and precise tool placement. The arm design is highly adjustable to accommodate various wafer sizes and working distances, and its robust construction allows for a long operational life with minimal maintenance. STRASBAUGH 6ZR-2 also utilizes powerful abrasive motors, which are equipped with unique variable speed control and electronic sensors to provide precise control over the abrasive force. This feature enables the machine to provide a high degree of process uniformity. An elevated vacuum pump is included to enable removal of all debris from the tool and work area, while also allowing for efficient operation of the lapping and polishing process. The tool also includes a unique sink-type polishing head which is designed to reduce workstation downtime. 6ZR-2 offers versatile control features to ensure optimal repeatability and consistency. The built-in controller provides a user-friendly graphical interface, allowing for real time monitoring of process completion and storage of process parameters. Furthermore, automatic statistical process control (SPC) analysis ensures tight control of the grinding, lapping and polishing process. STRASBAUGH 6ZR-2 is a complete asset solution for wafer grinding, lapping and polishing, providing precise control, repeatable results and long-term reliability. Its robust construction, advanced features and automated operation make it the perfect choice for semiconductor applications including wet grinding, dry lapping, and polishing. This model provides superior quality and accuracy, and is sure to increase the throughput of any wafer fabrication process.