Used STRASBAUGH 7AA-II #9238528 for sale

STRASBAUGH 7AA-II is a wafer grinding, lapping and polishing equipment designed for optimal defect-free semiconductor manufacturing. This system utilizes a fully automated mechanical process to rapidly produce highly polished, defect-free wafers. STRASBAUGH 7 AA II features a sophisticated modular design that is well-suited for wafer batch processing. It contains two separate workstations, equipped with independent mechanical and electrical systems, designed for maximum control of the grinding and polishing operations. The unit's two-stage grinding process eliminates wafer warping that is often encountered when using conventional single-stage systems. The first stage utilizes a slow, controlled motion for grinding, designed to keep tight control over the wafer's edges, followed by the second stage's rapid, coarse grinding operation. The second workstation provides an automated lapping process. This secondary step helps to further improve the surface finish of the wafer, creating a smooth, even surface. For the polishing step, the machine employs a 3-axis polishing device with continuously adjustable time and pressure intervals to ensure that the wafer achieves the highest possible level of uniformity in surface finish. 7AA-II also offers a number of key advantages over other grinding, lapping and polishing systems, including customizable operating parameters, superior tool performance, and improved waste handling capabilities. Additionally, the automated asset allows for improved process stability and repeatability, making it ideal for high-volume production. With its optimized and efficient design, 7 AA II provides a reliable solution for achieving defect-free wafers in semiconductor manufacturing.