Used STRASBAUGH 7AA-SP #9398708 for sale

STRASBAUGH 7AA-SP is a leading-edge wafer grinding, lapping, and polishing equipment designed to produce high-precision semiconductor wafers. It is capable of accommodating wafers up to 7 inches in diameter, and is equipped with an advanced vision system for precise alignment. This unit includes a high-powered spindle motor, electro-optical encoder, and low-pressure drive to produce the precise and uniform grinding parameters required for efficient process control. 7AA-SP can use either a single abrasive wheel or two separate abrasive wheels which are mounted on drives to achieve controlled grinding and polishing speeds. The machine is equipped with a two-axis grinding and lapping head, allowing precise control of the specified part parameters. The head includes a wear-resistant ceramic cup wheel for grinding and is capable of three-axis motion for maximum orientation flexibility during the grinding process. It features precise clamping and swivel mechanisms to ensure accurate part alignment and to ensure a precise grinding gage. STRASBAUGH 7AA-SP also features an easy to use control panel and an automated positioner tool to easily index the head in precise locations.The control panel provides an easy to use interface, which displays all relevant machine parameters including level of power, grinding angle, spindle speeds, grinding time, and emergency stops. 7AA-SP also features a top-of-the-line vacuum chamber, designed to provide efficient dust extraction and to keep the working environment clean and safe. The chamber also features an evacuated-air asset which creates an air tight seal for optimal grinding results. In addition, the model includes a unique forced-air pressure module, which uses a high-velocity stream of air to clean the grinding and polishing debris from the workpiece. This helps to improve the grinding results and prevents machine build-up from interfering with the polishing process. STRASBAUGH 7AA-SP is an innovative and versatile wafer grinding, lapping, and polishing equipment that is capable of producing high-quality results with unmatched precision. Its top-of-the-line features, combined with its advanced system control, make 7AA-SP ideal for those who need high-precision and high-efficiency grinding, lapping, and polishing of semiconductor wafers.