Used STRASBAUGH 7AA #191945 for sale
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ID: 191945
Wafer Size: 12"
Semi-automated wafer grinders / Back grinder, 6"
Manual wafer handling, not cassette-to-cassette
Concentrically mounted grinding wheels on a single air bearing spindle
Alignment and dual-grind capability single-chuck design
Three-arm, two position pick and place robot
Dual input and output cassettes for high volume
7AA Manual version:
Grinding method
Built-in measurement technologies as automated tool
Non-standard shapes & substrates up to 12" in diameter.
STRASBAUGH 7AA is a powerful and reliable wafer grinding, lapping & polishing equipment, designed to handle large diameter substrates with very small radii. This system comes with a 350mm or smaller diameter holding chuck and is capable of grinding and polishing wafers up to 30 inches in diameter. It features a high-pressure water delivery unit, brushless motors for increased torque and tuning, an advanced polishing head, a precision mechanical grinding head, and a stainless steel worktable, which provides a smooth, durable surface for processing various types of wafers. STRASBAUGH 7 AA is a multi-variable wafer grinding machine capable of both single- and double-side grinding operations. It allows users to control the amount of pressure applied to the wafer during grinding and polishing. This tool also includes a touch screen interface for ease of operation, allowing users to set parameters like grinding pressure and disc speed. The grinding head can be adjusted to operate in the horizontal or vertical directions, for maximum precision and efficiency. 7AA is equipped with the precision grinding head, which is designed to handle small radii and high-precision grinding jobs without sacrificing quality. The high-pressure water delivery asset delivers an evenly distributed spray of water, aiding in grinding and polishing. The brushless motors provide increased torque and the digital speed controller makes for smooth operation of the discs. The model's advanced polishing head is capable of producing superior finishes in a variety of applications, delivering consistent smooth surfaces with low particulate counts for improved wafer reliability. The fineness of the polish is adjustable, adjusting the output from coarse to fine grinding. The stainless steel worktable features a double-polished surface to ensure a superior finish. 7 AA is an ideal equipment for high-precision grinding and polishing of wafers with small radii. Its multi-variable design allows users to adjust the parameters of the process, allowing them to achieve superior finishes. The advanced polishing head and high-pressure water delivery system ensure a consistent and reliable finish, making it an ideal choice for a wide range of applications.
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