Used STRASBAUGH 7AA #39287 for sale

STRASBAUGH 7AA is a high performance wafer grinding, lapping and polishing equipment designed to provide an efficient, accurate, and reliable solution for the most demanding thin wafer-level operations. The machine features a rotating turntable design, which enables simultaneous grinding, lapping, and polishing of up to 150 wafers. The platform is equipped with a pair of main grinding and lapping heads, each with a 127 mm wheel diameter and variable wheel speed range of 50 to 400 rpm. Additionally, a pair of pre-grinders are fitted with 50 mm wheels and variable wheel speed of 400 to 5000 rpm. The robust, dual-head setup ensures high part-to-part and within-part repeatability for maximum production yield. The turntable also holds an automatic dosing system and a polishing platen, complete with a variable pitch polishing head. Each work station is configured with an optically-coupled drag unit with adjustable drag force, allowing accurate control of process parameters while ensuring precise wafer-level geometry The adjustable pitch polishing head, which ranges from 25 micrometers to 50 micrometers, provides precise angle control and polishing along a full raster pattern. The machine can be opened or closed for easy operation and maintenance. The integrated vacuum machine allows for fine-grained control of the environment for precise polishing, which can be adjusted to ensure consistent operation and process optimization. STRASBAUGH 7 AA is equipped with a high-performance computer for full automation of the process, and to ensure fast, precise control of the wafer grinding, lapping, and polishing process. Additionally, a user-friendly, intuitive human-machine interface (HMI) provides comprehensive tool control and monitoring capabilities. The machine is designed to accommodate a variety of wafer-level applications, including IC's, CMP, MEMS and other specialty technologies. Advanced optical, electrical and thermal systems provide continuous process monitoring and corrective action, ensuring process optimization and yield improvement. With its proven performance, flexibility, and accuracy, 7AA is an ideal solution for high-precision wafer grinding, lapping and polishing operations. The asset provides a fast and powerful solution for producing highly uniform and accurate wafers in a robust, production-oriented platform.