Used STRASBAUGH 7AA #9124369 for sale

ID: 9124369
Wafer Size: 6"
Wafer grinders Fully automated Capable of handling 75mm to 150mm wafers Capable of both single and two step grinding processes.
STRASBAUGH 7AA is a precision wafer grinding, lapping and polishing equipment designed for optimal surface finish of a wide range of semiconductor, MEMS, optoelectronic and related devices. It is available in a number of configurations that vary according to the specific process requirements. The system starts with a wafer holder that can accommodate up to eight wafers ranging in size from 100mm to 300mm in diameter. It has an ergonomically designed operator interface providing the ability to run multiple process sequences. The wafer holder is equipped with a patented "floating" wafer mount unit providing stable, repeatable results across all wafers in the stack. To maximize production throughput and process fidelity, STRASBAUGH 7 AA uses a combination of both grinding and lapping operations. The grinding process is accomplished through the machine's two wafer rotation axes, enabling three simultaneous operations. A top side rotary diamond disc grinds the surface of the wafer to the desired shape. A second rotation axis, configured as a vacuum elevator, retrieves the wafer from the holder and moves it through a series of inline grinding stations. As the wafer passes each station, the settings are changed to meet the specific wafer requirements. For the lapping process, 7AA uses a single-sided platen device. This device accommodates lapping materials such as diamond compound, boron carbide, glass beads, silicon carbide, and others as desired. The platen device includes a set of rollers that are adjustable to provide the optimal contact pressure between the wafer and the lapping plate. Following the grinding and lapping operations, 7 AA's polishing activity is achieved through the use of either a three-indenter burnishing tool or robotic arm-mounted polishing pads. The burnishing asset is a compact robotic arm model designed for a wide range of polishing operations such as planarization, beveling, chamfering, cross-hatch and more. The three-indenter pads are designed for both micro- and macro-polishing activities, and feature a patented anti-slip material that allows the pad to maintain contact with the wafer during polishing activity. STRASBAUGH 7AA is also designed for low-maintenance operations. A translucent cover shields the equipment from outside environmental conditions and minimizes dust contamination. The built-in microprocessor can be programmed to perform predetermined processes, eliminating the need for manual operation and ensuring repeatability across multiple productions. STRASBAUGH 7 AA also features a range of optional accessories such as a peristaltic pump for post-processing rinse and DI water, or a HEPA filter for a contained process.
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