Used STRASBAUGH 7AA #9265324 for sale

STRASBAUGH 7AA is a cutting-edge wafer grinding, lapping, and polishing equipment designed for automated wafer polishing and cleaning operations. This system is equipped with a fully automated loader and unloader for reliable, fast, and precise wafer processing. The advanced features of the unit include a one micron profile capability, 7" or 12" wafer capability, a low abrasive wear rate, and high-speed operation. The machine is built on a robust and versatile platform that can produce complex profiles, permit high repeatability, and offer high-accuracy and wafer-to-wafer uniformity. Made with the highest grade of diamond abrasives, STRASBAUGH 7 AA tool utilizes a unique CDP (Continuous Diamond Placement) that is engineered to maximize grinding efficiency, while minimizing abrasive wear. 7AA asset is designed with hardware and software that provide users with fast set-up times and offer easy operation and programming. The integrated software comes with a user-friendly graphical interface that can monitor every step of the wafer grinding, lapping, and polishing process. This feature allows users to view and adjust different parameters such as the number of passes, tilt angle, and material selection. 7 AA is equipped with a two-stage lapping assembly and a polishing head that supports a range of polishing pads. These parts are designed to work together in a motion sequence that ensures efficient and precise grinding, lapping, and polishing of the wafers. STRASBAUGH 7AA model also comes with a dedicated wafer chamfer tooling and a pre-alignment tool that ensure correct wafer placement and minimize human error. The equipment is designed for safe, easy, and accurate wafer processing. Safety features include an automatic air purge system, a self-locking chuck unit, and additional sensors and safety systems to detect any foreign material. It is capable of handling a variety of sized wafers and can process up to 4 wafers in simultaneous cycling mode. STRASBAUGH 7 AA is an extremely reliable wafer grinding, lapping, and polishing machine that meets the tight tolerances and uniformity requirements for a variety of industrial and commercial applications. It has been designed with advanced features that offer users a safe and efficient tool for achieving superior surface finish and wafer-to-wafer uniformity.