Used STRASBAUGH 7AF #293744033 for sale

ID: 293744033
Wafer Size: 4"-6”
Grinder, 4"-6” Chuck.
STRASBAUGH 7AF is a high-precision wafer grinding, lapping, and polishing equipment designed for the most demanding semiconductor applications. The system is specifically designed to produce consistent and reliable results in the smoothing and polishing of the surfaces of semiconductor wafers, in addition to other wafer preparation processes. STRASBAUGH 7 AF unit utilizes a powerful grinding, lapping, and polishing engine that is capable of removing a wide variety of materials from the wafer surface while ensuring the highest levels of precision and accuracy. This engine technologies allows the user to select a variety of grinding, lapping, and polishing parameters to optimize the surface finish of the wafer. The machine is equipped with a precision, automated wafer handling tool that controls the movement of the wafer and automatically places the wafer on the grinding, lapping, and polishing carriage. An automated cleaning asset enables fast turnaround time and efficient utilization of the grinding, lapping, and polishing media. In addition to its highly efficient grinding, lapping, and polishing engine, 7AF model also provides users with a suite of advanced options to streamline the process. These include automatic wafer alignment, automatic leveling, and user-defined grinding, lapping, and polishing recipes. The equipment also provides users with a variety of metrology options designed for precise measurements of the wafer surface. Overall, 7 AF is a highly engineered and reliable wafer grinding, lapping, and polishing system designed specifically for the semiconductor industry. The unit is capable of providing precise and repeatable results that can be used to drive increased efficiency and reliability across all phases of semiconductor manufacturing.
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