Used STRASBAUGH 7AF #9067726 for sale

STRASBAUGH 7AF is a precision wafer grinding, lapping and polishing machine engineered for use in the wafer, MEMS and optoelectronics industries. It is designed to provide exceptional surface finish, fine flatness and high precision for wafer fabrication processes such as lapping, grinding, and polishing. STRASBAUGH 7 AF is powered by a motor drive equipment and a modular motion control platform to ensure a smooth, accurate operation. This drive system features constant-force technology and a closed-loop position control unit which allow operators to program multiple stages with independent axis movement profiles. 7AF is equipped with a linear motor which provides high precision and accommodates a wafer size range of up to 200mm in diameter. This is combined with a 6-axis motion control machine to create extremely accurate surface finish results. A range of process control software is provided with 7 AF for full automation of the grinding, lapping and polishing process. STRASBAUGH 7AF is configured with a high speed spindle motor with double ended grinding wheels. This high speed spindle motor is designed for rapid stock removal to provide faster grinding and superior flat surface finish. The grinding tooling is designed for an appropriate combination of wafer size, rotation speed and material to ensure optimal grinding performance. STRASBAUGH 7 AF is also equipped with an integrated ring lighting tool which ensures uniform illumination across the wafer's surface. This asset is combined with a high accuracy depth detection model to ensure precise positioning of the wafer during the grinding and polishing operations. In addition to wafer grinding, 7AF also provides automation for both lapping and polishing. The lap is constructed from a rigid convex-shaped disc which is driven by a belt transmission equipment. The polishing setup includes a belt-driven flat polishing disc, a polishing solution, and a polishing recovery system to capture spent solution and slurry. Overall 7 AF provides precise control and a high level of accuracy in grinding, lapping and polishing operations. From a single unit operators are able to achieve superior surface finish and flatness, as well as process high precision on a wide range of materials and wafer sizes.