Used STRASBAUGH 7E #9225012 for sale

ID: 9225012
Spindle polisher.
STRASBAUGH 7E is a powerful wafer grinding, lapping & polishing equipment designed for producing finely-turned, defect-free, and ultra-smooth surfaces on semiconductor wafers. The system utilizes a two-stage, rotary, table-top platform and provides a wide range of workholding options such as stationary, rotary, and custom fixtures. Designed with a high-power motorized DC drive, the unit has excellent power at low speeds and offers a range of power settings to match specific application needs. 7E's unique two-stage design allows for both grinding and lapping at varying pressure levels to produce superior surface quality with exceptional controlled material removal. The platform also accommodates the full range of substrate sizes (up to 8") and can handle a variety of tapered substrates with ease. STRASBAUGH 7E is a versatile machine, allowing for multiple grinding, lapping, and polishing options. It features a two-level workhead design that eliminates deflection during the grinding and polishing processes and reduces process variations. The tool also offers a range of abrasive and lubricant supply systems that can be adapted to a variety of applications. A selection of high-torque and high-force grinding/lapping/polishing heads optimize material removal and surface finish. The custom grinding/polishing fixture adjusts the pressure at each stage of the process to ensure ideal performance for each product. 7E is designed to be a robust, user-friendly tool, with a large, easy-to-read LCD control panel for intuitive operation. It contains advanced safety features, such as a fully enclosed control cabinet and low-level lockout capability to protect against unwanted operation. The re-programmable controllers feature on-screen troubleshooting guides and a choice of language options. The asset also offers an optional measuring and analysis software package, allowing for real-time process optimization. STRASBAUGH 7E offers performance and capability far beyond that of manual grinding and polishing equipment. This model promises repeatable, defect-free results, superior surface quality, and consistently uniform processing. It is an ideal solution for precision manufacturing of semiconductor wafers, providing the perfect combination of speed, accuracy, and reliability.
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