Used STRASBAUGH nTrepid 6EH #9266622 for sale
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The Straubaugh STRASBAUGH nTrepid 6EH is a wafer grinding, lapping, and polishing equipment specifically designed for the processing of 6" and 8" semiconductor wafers. The grinding and polishing of wafers is the first step in the manufacturing process of the majority of semiconductor chips used in everyday electronic applications. This system is ideal for producing high-performance, high-quality wafers. The unit utilizes the grind-polish technology of mechanical abrasion. In this technique a top and bottom spindle is used to move a substrate (the wafer) back and forth. Two diamond-infused adhesive sheets running parallel to the substrate provide the abrasive surface for the grinding and polish process. As the substrate and grinding surfaces move in opposite directions, a high levels of pressure is exerted on the wafer surface. This allows for highly precise control of the grinding process and produces the desired wafer finish. NTrepid 6EH also leverage the use of power tools with high-speed motors and specially designed drivers. The motor speed and driver type are optimized to both increase grinding speed and effectiveness, and to reduce grinding time. This allows the unit to quickly and effectively process wafers in low production runs. The machine also offers a wide range of flexibility in terms of grinding and polishing solutions. It boasts a range of polishing technologies - including chemical-mechanical polishing (CMP) - with the ability to precisely control the settings of the parameters such as the size of the wafer, the required level of polishing, and the pressure applied, resulting in the desired finish. The Straubaugh STRASBAUGH nTrepid 6EH is a quality tool used in a wide range of industries, including the production of integrated circuits and other electronic components. It's especially suitable for low production runs, thanks to its flexibility and speed. Additionally, its robust design, excellent control options, and precise finish make it ideal for producing top-tier semiconductor wafers.
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