Used STRUERS DAP 2 #97547 for sale

STRUERS DAP 2 is a professional-grade wafer grinding, lapping, and polishing equipment designed to deliver fast, repeatable, and highly accurate results for semiconductor, opto-electronics,TFT and MEMS wafer applications. DAP 2 offers a complete set of options and accessories for all types of wafer grinding and polishing, such as EDGE GRINDING, PROFILING, LAPPING, HAND POLISHING, and REACTIVE ION ETCHING (RIE). STRUERS DAP 2 is engineered for maximum accuracy and repeatability, enabling the user to achieve highly precise and uniform wafer grinding and polishing processes. The system is designed to meet the needs of research and production applications that require extreme accuracy and consistency. With the built-in PLC microprocessor-controlled unit, the user can quickly and easily adjust a variety of parameters and settings to create the desired results. With a wide range of optional grinding, polishing, and etching tools, DAP 2 creates optimal repeatable results. STRUERS DAP 2 incorporates numerous features to improve repeatability and accuracy. A high precision carriage inverting spindle assembly allows for rapid and precise wafer grinding movements and ensures the repeatability of the results. High speed grinding drives and a rotary table operation allows for efficient results and reduced grinding times. The machine also includes a high-precision linear encoder for precise positioning and fast processing. In addition, DAP 2 includes a wide range of options to facilitate efficient process development. These options include high-precision process control instruments and controllers, data acquisition systems, and a full selection of consumables and accessories. With the included edge grinding accessories, STRUERS DAP 2 can produce precise and repeatable grinder profiles for precise wafer edge finishes. An optional etching accessory is also available for precise and precise etching profiles for high-accuracy wafer etching results. DAP 2 offers excellent value for money and is designed to provide users with the best wafer grinding, lapping, and polishing performance. A wide range of applications makes it a perfect choice for research and production applications that demand precise and repeatable results.