Used STRUERS Discoplan-TS #9061588 for sale

STRUERS Discoplan-TS is an innovation in wafer grinding, lapping and polishing systems. The equipment is comprised of 4 stations: grinding, lapping, polishing and post-polishing. The grinding station includes an abrasive disk for grinding on a flat surface. The lapping station includes a two-station lapping machine, which uses diamond abrasives to level and polish flat surfaces. The polishing station provides a high-precision polishing of the wafer surface using a slurry and diamond abrasives. Finally, the post-polishing station uses a finer diamond abrasive to finish the wafer surface, removing any remaining macro-scratches. The system is designed to process up to 4 wafers at a time, with a total capacity of up to 16 wafers when using all 4 stations. The control of the unit is provided by a touchscreen user interface, which displays the progress of the process and allows for the adjustment of key parameters such as the rotational speed and pressure. This allows users to accurately control the quality of the wafer's outcome and maintain tight specifications for the product. The machine also includes a task planner, which allows for the scheduling of wafers for processing. This enables the scheduling of tasks on a first-in, first-out basis, creating faster turnaround times for production. Overall, Discoplan-TS offers complete accuracy and control that can be tailored to specific products or applications. Its advanced grinding, lapping, and polishing technology ensures a high-quality, repeatable result with minimal wasted material and an increase in throughput due to its multi-station design. STRUERS Discoplan-TS is ideal for a variety of applications, making it perfect for wafer grinding, lapping, and polishing projects.