Used STRUERS Duramin 500 T75 #112120 for sale
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ID: 112120
hardness tester
Motorized anvil / stange height adjustment
Test height: 0-305 mm
Throat depth 190 mm
Objective lenses 40x, 70x, 130x, 320x, 640x, 1280x
Load range 29 N to 7350 N
Automatic 5-position turret
Automatic image evaluation
Manual adjustment of anvil height
Camera: .5" camera, 1280 x 1024 pixels
Light source: adjustable LED
Display 8.4" TFT LCD, 170 x 130 mm, 800 x 600 pixels
Test anvil support 1" diameter
Max. specimen weight 110.2 lbs
Connection ports 2 USB, Ethernet, RS 232
Power supply 1 x 110-230 V / 50-60 Hz
Power consumption 200 VA
Dimensions: 69.1"height x 29.5"width x 27.6"depth
Including support table
Weight approx. 617.3 lbs
Shipping weight Approx. 992.1 lbs.
STRUERS Duramin 500 T75 is an advanced wafer grinding, lapping and polishing machine designed for the semiconductor industry. The machine is capable of wet or dry grinding and lapping, as well as polishing up to a 75 micron depth. Duramin 500 T75 features advanced automation features, including on-board data logging and analysis, a multi-channel controller, and focus tracking technology. Additionally, the machine has a load capacity of up to 400Kg and is capable of supporting up to five 500mm diamond grinding wheels. The machine is highly accurate and reliable, with repeat accuracy of up to ± 50 µm, offering superior performance in the production of high-precision semiconductor wafers. The machine is easy to operate and manage, with a user-friendly interface and intuitive operations. It is also certified for use in a cleanroom environment, helping to maintain the high standards of purity required for cleanroom applications. It offers a wide range of grinding, lapping and polishing processes, including single- and multi-level pulse grinding, flat lapping, and pre- and post-grinding cleaning. The machine is also equipped with the latest abrasive technology, allowing it to achieve superior results with minimal abrasive costs. In terms of safety, the machine is fitted with multiple sensors, including thermocouples for temperature measurement and alarm systems for potential dangers. The machine also comes with extensive documentation and worldwide service support, allowing users to easily access the documentation whenever required. The post-installation support also helps to maintain the machine in peak operating condition. Overall, STRUERS Duramin 500 T75 is a reliable and efficient wafer grinding, lapping and polishing system that gives users great control and accuracy over their processes. With its feature-rich design, intuitive operations, and advanced safety features, it is able to provide superior performance, stability, and reliability in the production of high-precision semiconductor wafers.
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