Used STRUERS RotoForce 4 #9097326 for sale

STRUERS RotoForce 4 is an automated wafer grinding, lapping and polishing equipment. It is designed to provide efficient and precise control over samples on a large variety of substrates such as silicon, glass, sapphire, ceramics, and metals. Furthermore, its advanced lapping technology enables the user to obtain the desired wafer surfaces in a few seconds, while its automated process control enables cost-effective and repeatable grinding and polishing results. RotoForce 4 system is made up of flexible modular components including an grinder, a polisher, a double-sided lapping head, and a protective cover. STRUERS RotoForce 4 grinder is designed to produce a high quality surface finish, with low vibration and minimal noise. Its large grinding wheel with a minimum diameter of 200 mm and drive power of 5 kW makes it suitable for wafer surface preparation for low and high power devices. The grinder is equipped with an adjustable grinding wheel to ensure uniform grinding results on various substrates and tight tolerance requirements. The polisher provides precise high-speed polishing for any flat surfaces on a variety of substrates. It utilizes a vacuum table with a high resolution image acquisition unit, which enables the user to make visual inspection of the polishing results. Its durable cast aluminum table is designed to handle high load wafer handling while its advanced polishing control features ensure consistent quality. Next, the double-sided lapping head provides a very fine surface finish with minimal subsurface damage on substrates ranging from fragile materials, such as single-crystal silicon and ceramics, to more robust materials such as sapphire and aluminum. RotoForce 4 also includes a cover designed to protect the machine from dust and provide a safer working environment. In conclusion, STRUERS RotoForce 4 automated wafer grinding, lapping and polishing tool is a highly efficient and precise solution for a large variety of substrates and applications. Its modular components include a grinder, polisher, double-sided lapping head and protective cover provide flexible and reliable performance and enable the user to obtain the desired wafer surface in a few seconds.