Used STUDER S20-OC #9052592 for sale

STUDER S20-OC is a versatile wafer grinding, lapping, and polishing equipment that is capable of processing 200 mm to 300 mm wafers, or larger, depending on configuration. By integrating advanced technologies and innovative software-based control systems, S20-OC system is designed to optimize productivity and uptime while minimizing costs. STUDER S20-OC has a highly modular, user-oriented design. Features include a fully automated process chamber, an intuitive user interface, precision servomotors, advanced sensors, and laser interferometry for precise wafer alignment and closed loop control. The unit includes a host computer, which is connected to the other components via a programmable logic controller (PLC). S20-OC is also equipped with an advanced machine of grinding, lapping, and polishing processes for wafers. The tool is capable of grinding, lapping, and polishing of up to eight wafers simultaneously with pre-set parameters. This enables the user to have automated processing of complex wafer shapes and sizes with a high degree of accuracy. The asset has capability for complete process control and monitoring, including process parameter measurement, model safety interlock, wafer load measurement, wafer maturation, and thermal control. In addition, the equipment can also save the parameters and sequence of operations for up to 25 wafer types for repeat production. STUDER S20-OC has a highly automated process chamber, which enables cost effective in-process and final cleaning and drying of wafers. Also, the system has a simple user interface, which guides the operator in setting up the unit and process parameters, and provides clear indications of errors or machine malfunctions. S20-OC incorporates advanced material management systems that enable the user to optimize the process performance and yields. Furthermore, the tool is equipped with contamination evidence indicators for wafers, thereby providing a valuable tool for troubleshooting. Overall, STUDER S20-OC is an excellent wafer grinding, lapping, and polishing asset that is highly reliable and user friendly. The model can be used for processing complex wafer geometries and complicated structures with high precision and repeatability. It is highly automated, and smart features such as process parameters and control monitoring provide improved process control. The excellent material management, thermal control, and contamination evidence indicators give the user better control over process yields.