Used SUMITOMO 08E503 #293616746 for sale

SUMITOMO 08E503 is a wafer grinding, lapping, and polishing equipment for semiconductor production. Suitable for both single and double-sided grinding, the system is capable of producing a high-quality, low-roughness finish with excellent uniformity and minimal chatter. The unit offers superior grindability with the latest grinding technology, including dynamically balanced grinding spindles, variable high pressure water nozzles and powerful vacuum systems. In addition, 08E503 provides high throughput capabilities with fully automated loading and unloading. SUMITOMO 08E503 machine is ideal for use in a number of different semiconductor production processes, including: wafer grinding, lapping, and polishing. The tool employs a variety of methods to achieve a finish quality level suitable for use in advanced integrated circuits. For wafer grinding, the asset is capable of processing up to a 6-inch wafer with a maximum loading force of approximately 100 kg. The grinding spindle is powered by a high speed direct drive motor, allowing the user to select a grinding speed of up to 300°/sec. The powerful vacuum model ensures high static holding forces suitable for both single and double-sided grinding. For lapping, 08E503 uses multiple precision machining methods, including vertical lapping, on-the-fly lapping and single-position lapping. The equipment has variable pressure nozzles for the application of a homogenous lapping fluid, and can produce a finish of up to 0.001 µm Ra. The variable nozzles are also used to lift the wafer from the grinding surface when lapping is complete. SUMITOMO 08E503 also includes an automated polishing system which is capable of applying various polishing compounds, depending on the required finish. The unit is fitted with a fully automated polishing head, which can process up to 10 wafers per cycle. The sophisticated polishing head is capable of achieving a mirror-like finish of up to 0.05 µm Ra, making it ideal for high-precision semiconductor production. In summary, 08E503 is a versatile and reliable wafer grinding, lapping and polishing machine capable of producing a high quality, low-roughness finish. With a variety of powerful and advanced features, the tool is perfectly suited for use in the semiconductor industry.