Used SUMITOMO TSP-50DPAW #9263633 for sale

SUMITOMO TSP-50DPAW Wafer Grinding, Lapping & Polishing Equipment is an all-in-one machine designed to address the needs for precision grinding, lapping and polishing of semiconductor wafers. It is capable of grinding, lapping, and polishing virtually any size of semiconductor wafers with micrometer-level precision. TSP-50DPAW consists of three major components: grinders, lappers, and polishers. The grinders provide the required grinding power and accuracy for a variety of applications, such as polishing, back grinding, precision removing material, and flattening. The lappers offer high-precision lapping, capable of achieving tight tolerance levels. Finally, the polishers offer the high accuracy and smooth surface finish finishes necessary for the best quality wafers. SUMITOMO TSP-50DPAW uses linear motors to drive its grinding, lapping, and polishing components, ensuring high precision and repeatability in its operations. Its grinding accuracy and capability is unmatched, with a repeatability of 0.5 microns and a uniformity of 0.1 microns. Its lapping accuracy is also highly precise, with a repeatability of 0.3 microns and a uniformity of 0.1 microns. Finally, its polishing accuracy and capability is impressive, with a uniformity of 0.05 microns, enabling the production of extremely smooth surface finishes. TSP-50DPAW is also designed for easy operation and maintenance. Its controller features a touch-screen operation with an intuitive interface for easy operation. Both its grinding and lapping heads also have a self-cleaning function which minimizes both maintenance time and cost. In summary, SUMITOMO TSP-50DPAW Wafer Grinding, Lapping & Polishing System is a high-precision, all-in-one unit designed for semiconductor wafer grinding, lapping and polishing. It has extreme accuracy and repeatability, with a repeatability of 0.5 microns for grinding, 0.3 microns for lapping and 0.05 microns for polishing. In addition, its user-friendly interface and self-cleaning functions make it a reliable and easy-to-use machine for those working with semiconductor wafers.