Used SWECO M18L #9227153 for sale

SWECO M18L Wafer Grinding, Lapping & Polishing Equipment is an automated, high precision processing system designed for maximum efficiency and accuracy. It is specifically designed for pre-stress and post-stress wet processing of silicon wafers, gallium arsenide, indium phosphide, sapphire, and other electronics substrates. The unit is built around a multi-zone grinding and polishing station, in which the wafers are transferred in and out via a simple robot arm. This robot arm is fitted with a wafer slicer and is capable of precisely handling wafer sizes ranging from 2-8 inches. The entire machine is constructed using stainless steel for greater durability, and is capable of simultaneous processing of multiple wafers. The grinding and polishing station includes an integrated vibratory bowl feeder, hydraulic clamping tool, pneumatic lapping/polishing mechanisms, and dynamic tilt head configuration. This station also includes a central processing unit which controls every step of the process, and an automated wafer detector asset which monitors each wafer position prior to lapping and polishing. M18L also comes with a variety of advanced technologies and software, such as: multiple data input/output options, advanced diagnostic systems, and operational sequences that optimize speed and precision. In addition, there are several user-adjustable parameters that allow for precise control over the speed and pressure settings during the grinding and polishing process. As a result of these features, SWECO M18L can be used to achieve high accuracy, smooth surfaces, and precisely thicknessed wafers, while maintaining minimal cycle times and cost efficiency. This model is perfect for processing different types of substrates with high precision and repeatability.