Used TACCHELLA 2628 UMP #9052594 for sale

TACCHELLA 2628 UMP is a state-of-the-art robotic equipment, designed for wafer grinding, lapping and polishing. It is a combined man-machine, as it is not fully automated, but requires an operator to help with the grinding, lapping and polishing processes. The system is comprised of a robotic arm mounted on a mobile platform, together with a set of components to handle and process wafers, including a grinding wheel, a lapping and a polishing head. The unit is equipped with a FANUC-control robot, with two Cartesian axes, designed for precision movement of the grinding, lapping and polishing heads in three dimensions. The robot can move the grinding head around in the X, Y and Z planes, and is capable of accurately controlling the speed and direction of movement, as well as positioning and orienting the grinding head in relation to the wafer. The machine is capable of dealing with wafers up to eight inches in diameter, and can offer a very high level of accuracy and precision grinding, with a range of 0.0004 - 0.0006 mils (depth of cut). This ensures that the wafer surface is surface-ground to a homogeneous finish, with no micro cracks or aberrations from the ideal surface. The choice of a number of grinding and polishing tools, as well as lapping and abrasive materials, allow the operator to tailor the tool to specific needs and requirements. In addition to the smoothness and accuracy of the grinding and polishing, the asset also features a wide range of safety features, such as a robotic arm which stops when the operator presses a hand control button, or when it detects an obstacle. Additionally, an acoustic alarm model is in place to alert the operator when the grinding, lapping or polishing head comes close to the edge of the wafer. Overall, 2628 UMP is a high-tech equipment and considerably improves the accuracy and reliability of the grinding, lapping and polishing processes, while keeping the operator safe.