Used TAISEI GRI-2000 #9093455 for sale

TAISEI GRI-2000 is a precision wafer grinding, lapping and polishing equipment designed to produce the highest quality and defect free polished surfaces. It has been specifically designed for use in applications where polishing of substrates generated from single or multiple bonded device technologies is required. GRI-2000 is capable of producing low values of surface roughness (Ra) in addition to high levels of flatness and finished wafer thickness control. TAISEI GRI-2000 consists of multiple independent process section modules which enable it to process up to 30 wafers at a time. Each process section module contains up to 4 wafers loading stations, polishing/lapping plate, polishing slurry, polishing pads and polishing head. The polishing head is driven by a variable speed, variable torque, direct drive motor which ensures precise wafer contact at low speeds while still maintaining an effective polishing rate. GRI-2000 also includes an integrated computer control system which enables users to program and store process parameters and monitor wafer progress during the polishing process. The polishing head of TAISEI GRI-2000 contains a series of pneumatic arms which provide the pressure required to drive the polishing heads against the wafers. The pneumatic arms are adjustable to allow for variation in the polishing pressure as well as the number of polishing passes to ensure defect removal and a consistent surface finish. Additionally, the head has a series of sensitive transducer sensors which enable it to measure wafer's flatness during the polishing process, and adjust the polishing pressure in response. GRI-2000 also includes a high-efficiency separating unit which allows for easy disassembly and cleanup of the machine. This efficient method of cleaning ensures that adhesive and surface contaminants are effectively removed from the process allowing users to obtain a consistent and high-quality finish. All of TAISEI GRI-2000's components are constructed from high-grade stainless steel and machined to a tolerance of 4 microns, ensuring that the tool is highly durable. Additionally, the asset is available in a variety of sizes and configurations allowing it to be tailored to meet specific requirements. In conclusion, GRI-2000 is an advanced wafer grinding, lapping and polishing model capable of producing high-quality surfaces and controlling wafer thickness and flatness. It is well-suited to applications requiring precision polishing of substrates generated from single or multiple bonded device technologies.