Used TAISEI TBL-12B #9007412 for sale

TAISEI TBL-12B is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to meet the needs of advanced semiconductor fabrication facilities. This system combines two separate technologies (mechanical grinding and chemical-mechanical polishing) into one unit, providing an efficient, all-in-one approach to producing high-precision finished microelectronic components. TBL-12B is equipped with a special mechanism that operates at high-speed, allowing it to effectively grind the surface of wafers to a high degree of flatness and uniform surface texture. The lapping procedure enables the wafer to be perfectly polished for optimal performance in the final assembly stages of semiconductor fabrication. A polishing process is potentially possible with the use of an optional liquid slurry, which can help improve the finished product and overall surface smoothness. TAISEI TBL-12B wafer grinding, lapping, and polishing unit is a fully automated machine featuring advanced microprocessor-controlled operation and feedback loop diagnostics. It offers a wide range of positioning steps, from rough lapping and fine polishing to extremely small lapping and polishing steps. The tool is equipped with an adjustable swing arm that helps to evenly distribute the pressure on the wafer during the lapping and polishing processes. Additionally, the asset is compatible with a range of optional accessories (such as grindstones, holder discs and diamond slurries) which can add flexibility to the results. TBL-12B is engineered for increased reliability, with a durable build and robust construction. It boasts superior power and speed when compared to similar systems, and features advanced automated control systems for ensuring the best results possible. This model is also designed with safety in mind, with full compliance to international ESD regulations and a wide range of safety features. Overall, TAISEI TBL-12B wafer grinding, lapping, and polishing equipment is an invaluable tool for semiconductor fabrication facilities that are looking for a reliable and efficient way to produce high-precision microelectronic components. It offers a range of features and functions that make it suitable for both large and small scale production, allowing for a more cost-effective approach to component manufacturing.