Used TAISEI TDP6B-7 #9400315 for sale

TAISEI TDP6B-7 is a wafer grinding, lapping and polishing equipment that is designed to provide superior surface finish, self-contained within a compact and cost-effective system. The unit can impact a wide range of applications, including semiconductor and optoelectronic devices, MEMs and nanotechnology processes. The machine consists of a grinding station and a polishing station with an integrated lapping tool between the two stages. The grinding station uses multiple parallelogram structures to combine high stiffness with low thermal displacement. This minimizes thermal distortions and provides consistent grinding performance. The grinding station also features selectable grinding wheels that can be easily adjusted and changed to optimize the surface finish parameters. The integrated lapping asset is capable of providing a smooth, homogeneous surface finish with very low residue levels. This is accomplished through the use of specially formulated slurry and proprietary lapping techniques. The lapping process is automated to ensure consistent results and maximum efficiency. The polishing station utilizes proprietary polishing techniques to achieve a very fine finish. The station has adjustable polishing heads and a feeding device which ensures that the polishing material is fed evenly and precisely to the heads. The polishing process is highly automated and can be set to run automatically without any manual intervention. TDP6B-7 is a cost-effective and reliable model that is designed to provide superior surface finish. The automation and adjustable parameters of the equipment make it suitable for a wide range of applications. The system will deliver consistent and reliable results, enabling users to achieve their desired surface finish parameters with superior accuracy.