Used TATENO HB4 400S #9362281 for sale

TATENO HB4 400S is a wafer grinding, lapping and polishing machine specifically designed for the production of semiconductor wafers. This equipment can be used for backgrinding, lapping and polishing of ultra-thin wafers from 38.1mm to 8" and 0.5mm to 2.0mm in thickness with a range of finishes. The fully-automated system is equipped with a high-precision spindle motor that offers superior grinding, lapping and polishing control. Additionally, HB4 400S also provides accurate positioning and precise alignment to ensure that product quality is consistent throughout the manufacturing process. The machine is a complete unit designed for optimal process control and repeatability. It features a double-sided wafer cassette to facilitate wafer placement, allowing for a high throughput rate. TATENO HB4 400S also offers various wafer cleaning options such as spin rinsing, chemical cleaning and air dryers, all conveniently integrated into the machine. A unique feature of this machine is its ability to perform both Backgrinding and lapping simultaneously. The efficient transfer mechanisms on HB4 400S provide excellent motion stability and repeatability, ensuring precise operations. The tool is also optimized for pulse-pressure filter control to help reduce airborne particles. Additionally, the automatic calibration and precise wafer clamping ensure that the wafers remain intact during grinding and polishing. TATENO HB4 400S is powered by an advanced controller which helps to monitor and adjust the machinery parameters for optimal performance. Additionally, it comes with a number of safety features such as an emergency stop switch, lockout/tagout and visual alarm asset. Its intuitive user interface allows for easy navigation and process visibility. The model also offers remote monitoring and controlled access to enable users to keep an eye on the production process from any location. To sum up, HB4 400S is an advanced wafer grinding, lapping and polishing equipment that offers reliable and precise control. It provides exceptional accuracy for grinding and polishing ultra-thin wafers and is equipped with a wide range of features to ensure high-quality yield and repeatability.